Super User
Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Junpus thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions.
Features:
1) We can tailor-make the most suitable blisters for your products,Blister Box, Plastic Blister, Vacuum Formed Blister, Thermorformed Blister
2) Various materials available: PVC, PS, PP, PE, PET, color sheet, flocked sheet
3) Thickness: according to your requirements and usage
JP-P400 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P400 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-P400 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
JP-P300 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P300 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-P300 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
JP-P230 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P230series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-230 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
JP-P130 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-P130 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full. Heat effect increased significantly.
JP-P130 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
JP-DL800B Made with high-purity thermal conducting materials, JP-DL800B exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment.
This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.
JP-T180 series is a gap filled with high-performance thermal conductivity material, mainly used in electronic devices and heat sinks or product transfer interface between the enclosure.
JP-T180 series has a good adhesive, flexible, good compression performance and excellent thermal conductivity.
So that it can be fully in use of electronic originals and the air discharge between the heat sink in order to achieve access to the full.
Heat effect increased significantly.
JP-T180 Series also has a certain degree of self-adhesive, compared to ordinary thermal insulation material in the product installation process has brought great convenience, easy off, easy to operate.
JPNS200 are formulated with Synthetic fluids and highly conductive ceramic fillers. These finely engineered compounds provide low bleed and solve the problems of contamination and migration associated with silicone based products.
They offer better stability for a longer life cycle with high thermal conductivity (2 W/m°K) and low thermal resistance (0.014 °C-in2/W).
Features:
1) We can tailor-make the most suitable blisters for your products,Blister Box, Plastic Blister, Vacuum Formed Blister, Thermorformed Blister
2) Various materials available: PVC, PS, PP, PE, PET, color sheet, flocked sheet
3) Thickness: according to your requirements and usage
Features:
1) We can tailor-make the most suitable blisters for your products,Blister Box, Plastic Blister, Vacuum Formed Blister, Thermorformed Blister
2) Various materials available: PVC, PS, PP, PE, PET, color sheet, flocked sheet
3) Thickness: according to your requirements and usage