JunPus

JP-DL600 Made with high-purity thermal conducting materials, JP-DL600 exhibits excellent thermal conduction thanks to its finer molecular structure produced by nanoscale treatment. 

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

JP-DL600 Thermally conductive compounds are grease-like products which is formulated with Nano diamond powder and silicone fluids as base oil to provide superior thermal conductivity.

Good performance is obtained when use JP-DL600 for thermal conductivity of semiconductor devices, such as CPUs, ICs, High Power LED and power transistors.

Application:
Main ingredients:Nanodiamond, silicon
•Major applications:
o Heat sink interface for the high-power chips in power source electronics such as power supply
o Heat sink interface for High Bright LED High Bright LED
o Heat sink interface for CPU in various computers or high-power chips
o Heat sink interface for Graphics Processing Unit (GPU) in different display cards
•This product complies with the RoHS (Restriction of use of hazardous substances) Directive: SGS no.CE/2008/12124
•Thermal Conductivity:3 (W/m•K)

Product Features: 
•Superior thermal conduction and low thermal resistivity.
•Wide range of applicable temperatures and stable thermal conductivity.
Better Rcontact : advantage II
•Easy to work with, non-caustic, anti-oxidation, not easily solidifying.



Coralloid shape
worse mobility and voids forming

Summary of Diamond Characters