Super User
Thermal compound is necessary to create a reliable transfer of heat from your computer's processor to its heatsink to keep your CPU from overheating. Junpus thermal compound does this with three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. It's optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions.
NANO Diamond Thermal Pad
We make available for our clients a top-of-the-line range of NANO Diamond Thermal Pad which is mainly used in electronic devices and heat sinks or product transfer interface between the enclosures. The combination of a tough carrier material such as fiberglass and thermally conductive silicone rubber which is conformable provides the engineer with a more versatile material than mica or ceramics and grease. Our product is known to be a special type of chemical that greatly improves heat transfer as well as the cooling of the processor. The combination of a tough carrier material such as fiberglass and thermally conductive silicone rubber which is conformable provides the engineer with a more versatile material than mica or ceramics and grease. Thermal Pad based on silica gel as a substrate, adding metal oxides and other auxiliary materials, a thermal conductivity of dielectric materials synthesized through a special process. The pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. It is designed to take advantage of the design of the gap transfer heat production, able to fill the gap to complete the heat transfer between the heating part and cooling parts, and also played the role of insulation, cushioning, sealing, etc. It is able to meet the requirements of equipment miniaturization and ultra-thin design, is an excellent thermal conductivity filler material whit highly technology use, and for a wide range of thickness. Our products also have high thermal stability that results in making them perform under severe conditions.
If you have never built a computer there is a fair chance you have no idea what thermal paste is. Also referred to as thermal Grease, thermal compound and “oh really?, I hope that doesn’t stain”. “Thermal Conductivity compound” as JunPus calls it, is the heat conductive material that serves as the physical intermediary between your cooler and your CPU.
We are engaged in offering a wide range of Thermal Compounds that are manufactured using state-of-the-art technology and latest machinery. They are silicone fluids based on silicone, adding filler, thermal conductivity materials, and other polymer materials, with good thermal conductivity, electrical insulation, and are widely used in electronic components. Stringently formulated using optimum quality ingredients, these are formulated in accordance with set industry standards. The range will not harden or dry out or melt even after 1000 hours 200℃with good single component modified silicone system suitable for heat sink application. Due to use of cost efficient technology in our assembly unit, we can supply our complete range to the customers at market leading prices. Our expertise allows us to offer a comprehensive range of Thermal Compounds, which is developed in tandem with the international quality standards. Customer satisfaction is of prime importance at this field enterprise and so supreme quality raw materials are used for manufacturing the products. They insulate the hot surface, ensuring energy conservation, protection of operators and providing comfortable work environment. Owing to their features like impeccable quality, easy to use and longer life these are highly appreciated by our clients throughout the world. We devise our range with most modern state of the art facilities and our expertise also allows us to empower them with unmatchable uncompromising quality & outstanding services.
JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology.
Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its
finer molecular structure produced by nanoscale treatment.
JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology.
Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its
finer molecular structure produced by nanoscale treatment.
JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology.
Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its
finer molecular structure produced by nanoscale treatment.
JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology.
Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its
finer molecular structure produced by nanoscale treatment.
JP-D-Series is a top-quality heat sink compound product developed most recently by Russian nano technology.
Made with high purity thermal conducting materials, JP-D-Series exhibits excellent thermal conduction thanks to its
finer molecular structure produced by nanoscale treatment.
Manual syringe assemblies
Manual syringe assemblies in sizes from 1ml to 60ml either graduated or unmarked. Select either luer lock tip end (twist on) or luer slip tip end (push on). Syringes are supplied pre-assembled ready for use and can handle most gels, glues, inks, grease, adhesives and other fluids.
Clear syringe barrel assemblies include plastic push rod and rubber wiper piston. Either luer lock or luer slip versions. In sizes 1cc to 60cc. Compatible with most liquids, pastes and adhesives. Low cost solutions for applying liquids.